威科赛乐微电子股份有限公司

01 Crystal preparation technology

Crystals are mainly prepared using Vertical Gradient Freeze (VGF) technology.

Advantages of VGF:

Simple technological process and good repeatability.
Easy to implement program control.
Shape determined by the crucible contour with high crystal utilization rate.
Small temperature gradient, small crystal thermal stress, less defects, good crystalline perfection, etc.

02 Substrate manufacturing technology

A technology for processing a crystal into a substrate, which can be used to manufacture semiconductor devices through several technological processes such as dicing, edging, grinding, polishing, cleaning, etc.

dicing

Multi-wire cutting technology is adopted, which is currently the most advanced cutting technology in the world. The high-speed steel wire drives the cutting edge material attached to the steel wire, to move backwards and forwards against a crystal bar, thus achieving the cutting effect.It has many advantages

Technical advantages of dicing

small BOW and WARP
good TAPER
small total thickness tolerance (TTA) discreteness
small cutting loss of cutting edge
shallow surface damage layer
small surface roughness of substrate, etc

03 Epitaxial growth technology

MOCVD system imported from Germany is used. The epitaxial wafers are produced using internationally leading epitaxial growth technology.

The AIX 2800G4 system imported from Germany is an advanced thin film manufacturing system with a high utilization rate for growing epitaxial thin films for GaAs devices. With our special design of the epitaxial layer and precise control of various growing conditions, epitaxial wafers grown using this system have advantages of high consistency, good uniformity, good appearance and high comprehensive yield of various indexes, and they can fully meet customer requirements for various epitaxial wafer indexes.

04 Chip processing technology

Our company adopts leading domestic and foreign processing technologies to process epitaxial wafers by using evaporation, lithography, etching, cleaning, grinding and dicing, to produce chip products with corresponding functional applications.

01

evaporation
02

lithography
03

etching
04

cleaning
05

grinding
06

dicing

Lithography procedure

At present, we have the Canon I5 series lithography machine. The exposure line width accuracy can be greatly reduced using our unique multi-exposure technology, and the minimum line width can reach about half of the line width when using standard lithography machines.

Etching procedure

We possess a variety of etching monitoring technologies for accurate etching monitoring of the etching target film layer. Our technology features high etching accuracy, strong controllability and high yield.

Grinding procedure

We use the automatic grinder to reduce the thickness of chip wafers. The thickness of the wafer is generally about 650μm, and the final chip thickness is usually less than 100μm.

Dicing procedure

Our cutting process features characteristics of high cutting efficiency, high precision and high yield, and can fully meet the requirements of different customers for wafer materials.

Fully automatic AOI sorting procedure

We have several imported fully automatic AOI inspection equipment. AOI (Automatic Optical Inspection) allows 2D/3D optical visual inspection with inspection accuracy up to the micron level, for linked grade classification using the automatic die sorter, which fully guarantees the controllability of shipped chips’ appearance yield.